Laser drilling up to 15,000 holes/sec in silicon wafer for PV solar
One approach to realize a back contact solar cell design is to `wrap'' the front contacts to the backside of the cell [1]. This results in significantly reduced shadowing losses, possibility of simplified module assembly process and reduced resistance losses in the module; a combination of measures, which are ultimately expected to lower the cost per watt of PV modules. A large
Silicon Laser Drilling
We deliver ultra-high precision silicon laser drilling services. Silicon is the most widely used material in numerous fields – semiconductors, electronic devices, computer chips, solar
Silicon Wafer Drilling
Contact us about silicon wafer drilling & hole drill technologies. Potomac Photonics are experts at laser micromachining small features in silicon wafers. Contact us about silicon wafer drilling & hole drill technologies. Request a
(PDF) Systematic Optimisation of Process Parameters in
In this paper we demonstrate high-speed laser drilling of 50 μm through-vias into 200 μm thick monocrystalline silicon wafers for PV cells. This is required as process step for MWT cell...
Laser drilling up to 15,000 holes/sec in silicon wafer for PV solar
One approach to realize a back contact solar cell design is to ''wrap'' the front contacts to the backside of the cell [1]. This results in significantly reduced shadowing losses, possibility of simplified module assembly process and reduced resistance losses in the module; a combination of measures, which are ultimately expected to lower the cost per watt of PV modules. A large
Understanding the mechanism of ultrasonic vibration-assisted drilling
Hence, non-traditional cutting methods like UVAD hold promise for precision micro-hole drilling in silicon wafers. In order and physics; for example, monocrystalline silicon has been used in solar cells with doped ZnO lms [2], cancer treat-ment with
Laser drilling up to 15,000 holes/sec in silicon wafer for PV solar cells
A large number of micro-vias must be drilled in a silicon wafer to connect the front and rear contacts. Laser drilling was more »
Novel laser technologies for crystalline silicon solar
silicon wafers can save a significant amount of money. Therefore cell manufacturers continue to push the solar cell thickness of currently 150-200 µm further down.
A review on laser drilling and cutting of silicon
The use of static solution-assisted laser drilling can effectively improve hole roundness, decrease taper angle, and reduce recast layer thickness and hole wall slag adhesion. This paper deals with the development of a new cutting method for thin silicon solar wafers with liquid-jet-guided lasers (LaserMicroJet®, LMJ, and Laser Chemical
Laser Applications in Solar Cell Manufacturing
Drilling of Wafers Rear side contacted solar cells eliminate the otherwise necessary front side strip lines and in this way, they enhance the solar-active surface and thus cell efficiency. What is more, the entire interconnection of solar cells into modules can be realized without any connec-tions from the front to the rear side: packing
Silicon Solar Cell
This type of solar cell includes: (1) free-standing silicon "membrane" cells made from thinning a silicon wafer, (2) silicon solar cells formed by transfer of a silicon layer or solar cell structure from a seeding silicon substrate to a surrogate nonsilicon substrate, and (3) solar cells made in silicon films deposited on a supporting substrate, which may be either an inexpensive, lower
Silicon Wafer Hole Drilling
Precision hole drilling in Silicon Wafers. We utilize a variety of processes that can produce holes as small as a few microns. Clean holes with controlled or little taper can be achieved in different sizes and thicknesses.
(PDF) Laser Processing of Solar Cells
Lasers are also being used to drill small holes through silicon wafers in the fabrication of metal-wrap-through (MWT) and emitter-wrap-through (MWT) solar cells. Lamers et al. 28 demonstrated
Laser Drilling
Laser drilled holes in silicon. K. Bui, "Laser drilling up to 15,000 holes/sec in silicon wafer for PV solar cells", SPIE Optics + Photonics, San Diego, CA, Aug 26-29, 2013; Laser drilling up to 15,000 holes/sec in silicon wafer for PV solar
Silicon Wafers: Powering Solar Cells
Solar cells are electrical devices that convert light energy into electricity. Various types of wafers can be used to make solar cells, but silicon wafers are the most popular. That''s because a silicon wafer is thermally stable, durable, and easy
High-speed laser drilling of EWT/MWT vias for backcontact solar
Within this time period for MWT, about 100 via holes with a diameter of 50-100µm through the silicon wafer, must be drilled. Fundamental mode lasers with a laser pulse length
Understanding the mechanism of ultrasonic vibration-assisted drilling
This study investigated the mechanism of UVAD using numerical and analytical techniques. Silicon wafers possess challenging cutting properties due to their inherent brittleness and susceptibility to cracking along specific crystal orientation. Hence, non-traditional cutting methods like UVAD hold promise for precision micro-hole drilling in silicon wafers. In order to
Drilling of Microholes on Silicon Wafer With Ultrasonic
Because silicon has high brittleness and hardness, drilling of silicon solar panels using traditional drilling methods might lead to solar panel cracking and low tool life.
Silicon Wafer Hole Drilling
Potomac Photonics are experts in silicon wafer hole drilling. Contact us about our industry leading micromachining and laser microhole drilling services. 301-310-6527. Request a quote. About. About Potomac Photonics. For the over 40
Impact of Laser Hole Drilling on the Fracture Strength of Metal
Cereceda and co-workers studied the of holes effect drilled with a -switched green laser (Q 515 nm wavelength, 10 ns pulse duration, and μJ pulse energy) on the 200 breakage force of solar wafers, and found that the wafers with a 100 holes/cm. 2. hole density are indeed statistically weaker than the reference wafers with no holes, even after
High-speed laser drilling of silicon wafers for photovoltaics
By applying two coupled Jenoptik Jenlas IR 70 lasers, it was possible to achieve 9,600 holes/s in wafers with 200 micron thickness and 12,500 holes/s in 180 micron
Laser drilling up to 15,000 holes/sec in silicon wafer for PV solar cells
A large number of micro-vias must be drilled in a silicon wafer to connect the front and rear contacts. Laser drilling was investigated using a pulsed disk laser which provided independent adjustment of pulse width, repetition rate and laser power.
Femtosecond laser drilling of crystalline and multicrystalline silicon
In this research, a femtosecond laser is employed to drill via holes in both crystalline silicon (c-Si) and multicrystalline silicon (mc-Si) thin wafers of ∼170 μm thickness
PHOTOVOLTAICS: New lasers advance efficiency and
In both cases 50 to 100 µm via holes must be drilled through 160- to 200-µm-thick silicon wafers. The back contacts can be accessed from the backside, as well as (former) frontside contacts (see Fig. 1).
High-speed laser drilling of silicon wafers for photovoltaics
Aachen, Germany – High-speed laser drilling is an important processing step in the production of high-efficiency solar cells, especially in the case of emitter-wrap-through (EWT) solar cells that require 10,000 and more vias to be drilled in each cell.
High speed laser drilling of solar cells | Laser Focus
There are two distinct ways of drilling large arrays of holes in this set-up. The first is synchronous drilling, where the laser beam is scanned repeatedly over the entire target pattern so that the effective percussion
Laser drilling of micro-holes in single crystal silicon, indium
Fig. 4 shows a photographic image of a whole patterned silicon wafer with a central laser-drilled hole using the IPG laser. The hole which was located in the centre of the pattern using a precision translation stage underneath the laser- drilling beam. The hole diameter was 550 µm and the exit diameter was 450 µm.
8.O.4_CSSC6_Full Paper Markus Oswald
Particularly, for solar cell concepts like Metal-Wrap-Through cells (MWT) or Emitter-Wrap-Through (EWT), the influence of laser drilled holes on the mechanical strength requires to be...
Laser drilling up to 15,000 holes/sec in silicon wafer for PV solar
Laser drilling up to 15,000 holes/sec in silicon wafer for PV solar cells Patwa, Rahul; Herfurth, Hans; Mueller, Guenther; Bui, Khan Proceedings of SPIE, Volume 8826 –
Micro-drilling of silicon wafer by industrial CO 2 laser
Background Laser micromachining is currently used in the MEMS production to replace the traditional etching process which consumes longer time to complete. The objective of this study is to investigate the drilling capability of industrial CO2 laser in processing of silicon wafer. Methods In this work, the holes were drilled on P-type silicon wafer with thickness of
Understanding the mechanism of ultrasonic vibration-assisted drilling
The SCE graph can predict the formation of a ductile regime on the cutting surface of the drilled micro-hole, although predicting micro-fractures on the side edges of the drilled micro-holes
Optimizing process time of laser drilling processes in solar cell
The p-type crystalline silicon wafers have occupied most of the solar cell market today. However, modules made with n-type crystalline silicon wafers are actually the most efficient modules up to